Recent listings on the CCC (3C) and SRRC certification platforms have revealed that a major new performance device has successfully entered the network. Certified under the model number 2604FRK1EC, the highly anticipated REDMI K90 Ultra is officially gearing up for a domestic launch in April this year. While this specific hardware configuration is a China-exclusive release, it serves as the foundation for the global market: international users will see this device launch as the Xiaomi 17T Pro later this year.
Groundbreaking Specs and Active Cooling
According to insights from well-known tipster @DigitalChatStation, the REDMI K90 Ultra is engineered from the ground up as an uncompromising performance machine. At its core is the cutting-edge MediaTek Dimensity 9500 processor, working in tandem with a dedicated display chip to maximize frame rates, optimize rendering, and reduce primary SoC load during demanding tasks.
The most striking technical addition to the China-exclusive REDMI K90 Ultra is its physical active cooling fan. Bypassing standard passive vapor chambers, this fan integrates directly with Xiaomi HyperOS Game Turbo. Users will be able to toggle a “Whole Scene fan” mode directly from the system interface, ensuring extreme thermal management during heavy workloads.
Powering this hardware is a massive 8000mAh+ battery, supported by the newly certified 100W ultra-fast flash charging. On the visual front, the device boasts a stunning 1.5K resolution display with a buttery-smooth 165Hz refresh rate, tailored specifically for competitive mobile gaming. Additionally, regulatory filings indicate the simultaneous development of a “K Pad 2” performance tablet and a potential new laptop. A separate device rumored to feature the new Snapdragon 8 Elite processor has not yet passed network certification and is not expected to debut at this specific launch event.
Markets
This specific fan-assisted model is exclusive to China, global consumers evaluating the upcoming Xiaomi 17T Pro will benefit from the same core processing power and similar battery advancements, albeit utilizing a traditional, fanless thermal architecture to maintain a slimmer profile.
