Emir BardakçıUntil now, MediaTek has officially announced the launch of its latest flagship SoC, Dimensity 8400, on December 23, 2024. This high-performance SoC is designed to ensure class-leading performance with efficiency, setting a new benchmark for mid-to-high-end smartphones.
Dimensity 8400 – Core Features and Specifications
The Dimensity 8400 is fabricated on ARM’s Cortex A725 cores, offering a good balance between high performance and power efficiency:
- 1 x 3.25GHz Cortex A725 Core for ultra-high performance in demanding tasks.
- 3 x 3.0GHz Cortex A725 Cores for a normal operation at high-speeds.
- 4 x 2.1GHz Cortex A725 Cores optimized for background tasks and power-saving operations.
GPUequipped with a 1.3GHz Immortalis G720 GPU and 7 cores for top graphics performance in gaming and multimedia, it also secures the latest AI-based rendering and ray tracing.
First Smartphones to Come with Dimensity 8400
That the Redmi Turbo 4 will be very much the first device in the world to bear the Dimensity 8400 onboard. For the international market, it will rebrand as the POCO X7 Pro and is positioned to be one of the major players in the mid-range lineups of Xiaomi.
Redmi to launch first smartphone powered by MediaTek Dimensity 8400
With the Dimensity 8400, MediaTek looks to cement its position in the premium mid-range chipset market, making flagship-level performance trickle down to more affordable devices. Now, all eyes are set on December 23 as this chipset is going to set the stage for the 2025 smartphones.
